Heat Sinks

Pressed Fin Heat Sinks
Product Code : 001M000870

This assembling operation ensures lowest thermal resistance between the base plate and the fins and allows therefore a nearly perfect heat move from the base plate to the fins.Widely applied in appliances , electronic industry, communication , lighting and new energy device, mainly such as heat semiconductor ( IGBT) cooling of ups, inverter, ac drivers and transducer etc.

Cofan USA, Inc

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United States